SiTest Solutions Ltd.
Technology Consulting Services
- Specializing in semiconductor IC & module-level manufacturing expertise
- Providing conuslting services from design to proto-type units to transfer to volume production
- Custom Multi-Chip-Modules & Specialized Board Level Products
- Product Manufacturing Enhancement Tools
Manufacturing Expertise
Custom Multi-Chip-Module (MCMs) and MEMs Devices
- MCM & MEMs design
Package Engineering Design (substrate design, material selection, proto-type assembly)
Production Solutions (full turn-key activity)
Packaging & Test Services
- Packaging (design & implementation)
- Test (program/application development, wafer sort / final test / characterization / qualification)
Reliability Studies (Operative Life Test HTOL, Temperature Cycling, 85/85)
Failure Analysis (SEM/EDX, X-ray, Decapsulation, Cross-Sectioning)
Yield Enhancement
Application Support in Asia
Key Technological Services & Advantages
SiTest Solutions Advantage
We provide specialty manufacturing (packaging + test + back-end) services for both low volume-speciality custom devices or high-volume technical support at manufacturing EMS/OSAT subcontractors located in Asia / China. SiTest Solutions has strong technical Manufacturing, Packaging, Test & Product Engineering expertise with language skills to complement -- fluent in English, Mandarin, and Cantonese. Translation services are available.
Technical Conduit to China
Our Engineering facility in Hong Kong is conveniently located on the Hong Kong express train line direct to Shenzhen. We easily support product logistically that requires a final destination in China (Beijing, greater-Shanghai area, Chengdu, Shenzhen).
Asian Factory Support
We have direct technical support teams located in: Hong Kong, China, Philippines, Singapore, and Thailand.
Manufacturing Expertise
Our Manufacturing Engineering teams have expertise in Design-For-Test (DFT) and Design-For-Manufacturing (DFM). We have the capability to develop new package designs, and then evaluate & characterize at both the wafer and package level. Electrical Test, ESD & Latch-Up studies, as well as Reliaibility testing can all be performed. Given our alliances with EMS/OSAT high-volume production facilities in Asia, we can easily transfer and monitor product during mass volume production.
ISO-9001:2000
Cert No 1210032037